Product Description
This 355nm UV laser cutting machine adopts cold ablation technology. It breaks the molecular bonds of materials directly instead of melting them, with nearly no heat-affected zone, no burning and no carbonization. Ultra-fine laser spot achieves micron-level precision, perfect for fine contour cutting and micro-hole processing. It is widely used for FPC flexible circuit board, PI film, PET film, PCB, thin glass, ceramics, silicone and other heat-sensitive precision materials. Optional laser power: 3W, 5W, 8W, 10W, 15W. Vision positioning system is optional for automatic alignment. Stable solid-state UV laser source, suitable for electronics, new energy, medical and packaging industries. Custom working size and fixture support.
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