Introduction to Precision Cold Processing Equipment
Product Introduction
The UV laser cutting machine adopts a 355nm UV laser source. It uses a high-energy-density laser beam to perform precision cutting, drilling, scribing and micro-processing on materials. UV laser is a "cold processing" technology with an extremely small heat-affected zone. It can effectively prevent burning, carbonization, deformation and burrs of materials, making it especially suitable for processing high-precision electronic materials and brittle materials.
The machine features a compact overall structure and small footprint. It is suitable for laboratories, small production lines and automatic integrated equipment.
Machine Dimensions
表格
| Item | Parameter |
|---|---|
| Working Area | 430mm / 640mm / 960mm (Optional) |
| Machine Structure | Integrated Precision Platform |
| Working Mode | Positioning Cutting |
| Compatible File Formats | DXF, AI, PLT, GERBER (Dedicated for Circuit Boards) |
| Power Supply | AC220V 50Hz, Rated Power 1500W |
Technical Specifications
表格
| Item | Parameter |
|---|---|
| Laser Type | UV Solid-state Laser |
| Laser Wavelength | 355 nm |
| Laser Power | 5W / 10W / 15W / 20W (Optional) |
| Cutting Accuracy | ±0.01 mm |
| Repositioning Accuracy | ±0.005 mm |
| Minimum Line Width | ≤0.02 mm |
| Cooling Method | Water Cooling |
| Control System | Industrial Motion Control System |
Product Features
表格
| Feature | Description |
|---|---|
| Cold Laser Processing | The 355nm UV laser directly breaks the molecular bonds of materials. It delivers a tiny heat-affected zone, and the edges are free from burning and carbonization. |
| High-precision Cutting | Suitable for micron-level processing. It supports complex patterns, special-shaped contours and ultra-fine circuit processing. |
| Non-contact Processing | No cutting tool contact with the workpiece. No mechanical stress is generated to reduce the risk of material damage. |
| Superior Processing Quality | Smooth cutting edges with few burrs, reducing post-processing procedures. |
| High Automation | Supports CCD visual positioning and network connection. |
Applicable Materials
表格
| Category | Materials |
|---|---|
| Circuit Board Materials | FPC Flexible Circuit Board, PCB Rigid Circuit Board |
| Film Materials | PET Film, PI Film, PP Film, Coverlay, Optical Film |
| Metal Foils | Copper Foil, Aluminum Foil |
| Hard & Brittle Materials | Ceramic Substrate, Sapphire Glass, Phone Cover Glass |
| New Energy Materials | Lithium Battery Electrode Materials |
UV laser is especially ideal for processing precision films and circuit board materials in the electronics industry.
Application Industries
表格
| Category | Applications |
|---|---|
| Electronics Manufacturing | PCB cutting, FPC cutting, semiconductor packaging, IC substrate processing |
| Consumer Electronics | Phone glass processing, camera module processing, touch screen cutting, OLED display processing |
| New Energy Industry | Lithium battery tab cutting, battery separator cutting, battery protective film processing |
| Medical Industry | Medical device micro-processing, medical film cutting, precision component manufacturing |
| Optoelectronic Industry | Optical lens processing, optical film cutting, LED material processing |
| Precision Manufacturing | Ceramic cutting, sapphire processing, micro-hole drilling, precision component fabrication |
UV laser technology is widely used in electronics, semiconductors, medical treatment, new energy, precision manufacturing and other industries.